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NXP Semiconductor to Deliver Low-Power Wireless Chips for Phonak Bluetooth Hearing-Aid Platform

February 1, 2009 by Dave Copithorne 

NXP, the independent semiconductor company founded by Philips, said it will develop a single-chip, ultra-low-power radio for use in hearing systems developed in collaboration with Phonak. The new chip is currently being integrated into Phonak’s portfolio of CORE-based hearing aids and wireless accessories providing wireless connectivity between hearing aids and a variety of Bluetooth phones, MP3 players and other consumer devices.

Solving the power-drain problem has been a major issue in integrating wireless technology into hearing aids tiny enough to fit in or behind the user’s ear, leading to an intense push by semiconductor makers to provide smaller processors chips requiring less battery power. “Working with a leading semiconductor player such as NXP has enabled Phonak to rapidly develop this new chip for our hearing systems”, said Hans Leysieffer, Phonak’s Vice President of R&D. “Combining cutting edge technology and expertise in ultra low power embedded software architecture enables Phonak to offer unparalleled hearing performance for hearing system wearers.”

The CORE platform still requires the user to wear a receiver around the neck that communicates with the hearing aids, and to operate the wireless system with a hand-held controller. But higher-performance radio chips that draw less power and take up less space will enable higher performing and easier to use solutions that eliminate many of the design limitations that have slowed user acceptance.

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